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= Method
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== 4H-SiC wafer details and Raman experiments setup
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== 4H-SiC wafer details
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外延片的厚度、掺杂浓度、生长 C/Si 比,斜切角度。
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@@ -17,6 +17,8 @@ The Al doping concentrations, determined by SIMS,
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W#sub[1]–W#sub[4] had an epitaxial layer thickness of 1 μm, while W#sub[5] had a thickness of 2 μm.
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The Si/C ratios during growth were 0.7, 1.2, 1.6, 2.4, and 2.0 for the five wafers, respectively.
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== Raman experiments setup
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拉曼设备的型号。激光的波长,背散射。共焦针孔。
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拉曼设备的型号是 LabRAM HR Evolution,使用背散射。
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@@ -44,7 +46,7 @@ The integration time was set to 60 seconds for normal and edge incidence,
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#include "figure-incidence.typ"
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== Simulation details
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== Atomic model establishment
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我们建立了三类模型:无缺陷、点缺陷和面缺陷。
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@@ -52,7 +54,7 @@ Three types of models were established: defect-free models, point defect models,
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无缺陷和点缺陷的模型
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无缺陷和点缺陷的模型尺寸为 xxA x xxA x xxA。
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无缺陷和点缺陷的模型尺寸约为 $12.4 angstrom times 10.7 #sym.angstrom times 10.1 #sym.angstrom$,包含了大约 128 个原子。
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我们认为是足够大的,因为无缺陷模型的结果与实验差距在一定范围内,且继续扩大模型对准确程度没有提升。
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对于点缺陷模型,我们考虑了 Si 空位、C 空位、N 替位、Al 替位。
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分别记为 V#sub[Si]、V#sub[C]、N#sub[Si] 和 Al#sub[C]。
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@@ -61,7 +63,9 @@ Three types of models were established: defect-free models, point defect models,
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此外,还有人提出,N 替换 C、C 替换 Si 的模型(引用),
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此结构除了 h 位与 k 位的区别以外,还需要考虑发生替换的两个原子位于面内还是面外(将会导致对称性的不同)。
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The defect-free and point defect models were established with a size of xxA x xxA x xxA.
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The defect-free and point defect models were established
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with a size of $12.4 #sym.angstrom times 10.7 #sym.angstrom times 10.1 #sym.angstrom$,
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containing approximately 128 atoms.
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This size should be large enough to calculate phonon properties for defect-free and point defect 4H-SiC,
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since the defect-free results obtained with these models were within 5% errors of the experimental data,
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and further increasing the model size did not improve the accuracy.
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@@ -105,6 +109,8 @@ For surface defect models, larger models where used to ensure the accuracy of th
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对于每类BPD,我们考虑两个模型,一个将两个 PD 包括在内,为了模拟 PBD 未分解或分解后边缘处的信号;
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另一类则仅仅包含一个贯穿的层错,为了模拟 BPD 分解后在层错处的信号。
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== Simulation details
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计算工具和参数
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第一性原理计算使用 VASP,使用 PBE PAW,平面波截断能在弛豫时使用 xx,在计算声子时提高到 xx。
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